Copper (Cu) Micron Powder, Purity: 99.9 %, Size: 325 mesh, Spherical
- SKU:
- NG01EM1305
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Description
5 grams/8 €
25 grams/32 €
100 grams/108 €
500 grams/198 €
1000 grams/390 €
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Copper (Cu) Micron Powder
Purity: 99.9 %, Size: 325 mesh, Spherical
Copper micron powder is a high-purity, fine metallic material with spherical morphology that ensures excellent flowability and uniform packing. Its stable structure and superior electrical and thermal conductivity make it a versatile raw material for advanced manufacturing processes. The powder form allows easy integration into composites, coatings, and specialized formulations, supporting both industrial and research applications.
Technical Properties
| Purity | 99.9% |
| Particle Size | 325 mesh |
| Density | 8.94 g/cm³ |
| Melting Point | 1083 °C |
| Electrical Conductivity | 0.593 μΩ⁻¹ |
| Crystal Structure | FCC |
| CAS No | 7440-50-8 |
Applications
- Electronics: Used in conductive pastes, circuit boards, and microelectronic components for reliable electrical performance.
- Metallurgy & Powder Processing: Applied in powder metallurgy for producing dense, high-strength copper-based parts.
- Additive Manufacturing: Serves as feedstock for 3D printing and metal injection molding of complex geometries.
- Catalysis: Utilized in chemical reactions and catalytic systems due to its high surface activity.
- Thermal Management: Incorporated into composites and coatings to enhance heat dissipation in electronic and mechanical systems.
- Protective Coatings: Provides corrosion resistance and conductivity in specialized industrial coatings.
- Research & Development: Employed in experimental studies on nanocomposites, conductive inks, and advanced material systems.