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Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/92:8

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NG04EO2703
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Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles

Size:  35-95 nm, Sn:Cu/92:8 

Copper Tin (Cu-Sn) alloy nanopowder is a fine tan-colored powder composed of nanoscale particles of copper and tin. At the nanoscale, the alloy exhibits enhanced reactivity, high surface area, and uniform dispersion, which make it suitable for advanced material applications. The combination of copper’s electrical conductivity and tin’s corrosion resistance provides a balanced set of mechanical, thermal, and chemical properties. This alloy is historically recognized as bronze, valued for its durability and versatility, but in nanoparticle form it offers improved catalytic activity, sintering behavior, and compatibility with composite systems.

Technical Properties

Alloy Ratio (Sn-Cu) 92-8
Average Particle Size (nm) 35-95

Properties, Storage and Cautions

Sn-Cu alloy nanoparticles are highly reactive, therefore it should be handled with care and rapid moves, vibrations should be avoided. The powder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, the powder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.  

Applications

  • Bearings: Cu-Sn alloy nanoparticles are used in bearing materials due to their wear resistance and ability to reduce friction under mechanical stress.
  • Electrical Contacts: They are applied in electrical contacts and connectors, benefiting from copper’s conductivity and tin’s stability, ensuring reliable current transfer.
  • Ship Propellers: Bronze-based nanopowders are utilized in marine components such as propellers, offering corrosion resistance in seawater environments.
  • Sculptures and Musical Instruments: The alloy continues its traditional role in artistic and cultural applications, providing durability and aesthetic appeal in sculptures and instruments.
  • Semiconductor Interconnections: At the nanoscale, Cu-Sn alloys are employed in semiconductor devices for interconnections that withstand high current densities and thermal stress.
  • Composite and Coating Materials: They are incorporated into advanced composites and anti-corrosion coatings, enhancing mechanical strength and extending service life.

 

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