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Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 20-35 µm

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NG04CO0807
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25 grams/18 €                       
100 grams/60 €   
500 grams/174 € 
1000 grams/318 €   

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Aluminum (Al) Micron Powder

Purity: 99.9+%, Size: 20-35 µm, Spherical

Aluminum (Al) Micron Powder is a high-purity metallic agent distinguished by its exceptional spherical morphology. This precise shape ensures outstanding flowability and high packing density, which are critical for preventing clogging in industrial feeding systems and ensuring a uniform layer in manufacturing. The powder is characterized by its lightweight nature and its ability to form a natural protective oxide layer, providing excellent stability. In composite applications, its spherical particles allow for seamless integration into epoxy and resin matrices, enhancing structural integrity while providing a smooth, high-luster finish. Known for its superior thermal and electrical conductivity, this material serves as a high-performance functional filler and a potent energy carrier in specialized industrial processes.

Technical Properties

Purity 99.9+ %
Particle Size 20-35 µm
Morphology Spherical
CAS No 7429-90-5 

Applications

  • Aerospace & Defense: Used as a high-energy additive in solid rocket propellants and as a core material for lightweight structural components.
  • Specialized Colorants & Pigments: Integrated into automotive paints and industrial coatings to provide a brilliant metallic finish and superior hiding power.
  • Conductive Epoxies & Adhesives: Acts as a functional filler to impart thermal and electrical conductivity to polymer resins and potting compounds.
  • Advanced Printing Inks: Utilized in the formulation of metallic inks for packaging and high-security printing due to its uniform particle size.
  • Nuclear Technology: Employed in the production of specialized alloys and as a moderator or reflective material in specific nuclear energy research applications.
  • Pyrotechnics & Explosives: Serves as a fuel source in controlled energetic compositions, providing high heat output and bright light emission.
  • Thin & Thick Film Circuits: Used in the electronics industry for creating conductive paths on various substrates through screen printing or vacuum deposition processes.
  • Additive Manufacturing: Ideal for powder-based 3D printing techniques where high sphericality is required for consistent layer deposition and minimal porosity. 

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