Copper Oxide (CuO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: < 77 nm

Copper Oxide (CuO) Nanopowder/Nanoparticles

Purity: 99.5%, Size: < 77 nm  

Copper Oxide (CuO) Nanopowder is a high-purity, p-type semiconductor nanomaterial engineered with a finely controlled particle size. Characterized by its distinctive fine black appearance and nearly spherical morphology, this powder offers an exceptional specific surface area that significantly drives high surface reactivity and chemical activity. Its advanced material design ensures superior particle dispersion, excellent physical stability, and optimal consistency across demanding structural matrices. Developed to satisfy rigorous industrial and scientific standards, it is a versatile choice for cutting-edge energy transformation, sensing tech, and specialized chemical synthesis.

Technical Properties

Applications

• Advanced Catalysis & Propellant Enhancement: This nanomaterial operates as a highly reactive catalyst in organic synthesis and industrial emissions control. It functions as a critical combustion catalyst in aerospace engineering, where it substantially enhances homogeneous propellant burning rates and lowers the operational pressure index.
• Semiconductor Technology & Energy Transformation: Widely integrated into electronic architectures, microelectronics, and solar energy conversion devices. Its engineered bandgap and structural uniformity make it ideal for fabricating high-performance p-type semiconductors, near-infrared filters, and advanced photothermal components.
• Sensing Devices & Information Storage: Utilized as a foundational active medium in high-sensitivity gas sensors, photoconductors, and high-density magnetic storage systems. Grain boundaries provide the rapid charge transport and precise magnetic response required for advanced data logging and environmental monitoring.
• Superconducting & Thermoelectric Materials: Leveraged in the manufacturing of high-temperature superconducting materials, thermoelectric generators, and advanced ceramics. Its nearly spherical particles facilitate optimal packing density and structural cohesion, significantly upgrading the thermal and electrical performance of final components.