Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 310 nm

25 gram: 35€
100 gram:84€
500 gram: 220€
1000 gram: 330€

Please contact us for quotes on larger quantities !!! 

Silicon Dioxide (SiO2) Nanopowder/Nanoparticles

Purity: 99.5+%, Size: 310 nm

Silicon Dioxide (SiO2) Nanopowder is a high-purity, synthetic spherical silica engineered through a specialized high-temperature flame fusion process. This advanced material design yields highly uniform, spherical particles that grant the powder exceptional fluidity, excellent packing density, and outstanding processing behavior. It is highly characterized by its low thermal stress and superior physical stability across demanding compounding environments. Meticulously manufactured to minimize internal stresses and optimize surface smoothness, this premium silica powder serves as a vital component for enhancing mechanical, thermal, and dielectric performance in high-end technological matrices.

Technical Properties

Applications

• Electronic Packaging Materials & EMC Fillers: Widely utilized as a premium functional filler in Epoxy Molding Compounds (EMC) and electronic packaging applications. Its perfect spherical morphology and low thermal stress significantly reduce the thermal expansion coefficient of encapsulation materials, protecting sensitive semiconductor chips from physical deformation.
• Advanced Plastics & Polymer Composites: Integrated into high-performance engineering plastics and resin matrices to enhance structural durability and stiffness. The outstanding fluidity of the spherical particles allows for very high filler loading levels during compounding without increasing melt viscosity, ensuring seamless extrusion and injection molding.
• High-End Coatings & Specialized Paints: Applied in industrial coatings and protective finishes to improve surface hardness, scratch resistance, and uniform gloss control. Thanks to the smooth surface of the spheres, it optimizes rheological flow and leveling properties, preventing common film defects during curing.
• Thermal Interface Materials & Insulation: Leveraged in the formulation of thermal management materials, lubricants, and high-performance adhesives. Its optimized particle packing behavior and physical stability contribute to reliable heat dissipation and long-term mechanical reliability in demanding automotive and electronic applications.