Silver Copper (Ag-Cu) Alloy Nanopowder/Nanoparticles  

Purity: 99.95% , Size: <110 nm 

Silver Copper (Ag-Cu) Alloy Nanopowder is a high-performance hybrid material engineered to bridge the gap between pure silver and pure copper nanoparticles, offering a synergistic combination of their most desirable properties. By integrating silver and copper at the atomic level, this alloy provides exceptional electrical and thermal conductivity while significantly enhancing oxidation resistance and mechanical durability compared to pure copper. Its high surface-area-to-volume ratio and refined particle size enable lower sintering temperatures and superior reactivity, making it a cost-effective yet premium alternative for high-tech industrial applications. This specialized nanopowder is designed for environments where maintaining long-term stability and high-speed electron transport is critical, ensuring reliable performance in demanding technological and scientific processes.

Technical Properties

Applications

• Electronics and Conductive Inks: Silver-copper alloy nanoparticles are highly prized in the electronics industry for their exceptional electrical conductivity and superior oxidation resistance compared to pure copper. They are extensively used in the formulation of conductive inks and pastes for printed electronics, flexible displays, and RFID tags. The alloyed structure reduces the electromigration issues often seen in pure silver, ensuring more stable and durable conductive paths in microelectronic circuits.
• Power Generation and Energy Storage: Due to their excellent thermal and electrical properties, Ag-Cu nanopowders are integrated into high-performance energy systems. They are utilized in the development of advanced electrodes for supercapacitors and batteries, where they facilitate rapid electron transfer and enhance energy density. Additionally, their stability makes them ideal for use in solar cell metallization, contributing to improved energy conversion efficiency.
• Advanced Manufacturing and Welding: Ag-Cu alloys are traditional brazing materials, but at the nanoscale, they offer significantly reduced melting points and enhanced diffusion properties. This makes Ag-Cu nanopowders ideal for low-temperature bonding and vacuum brazing in aerospace and automotive engineering. They provide high-strength, corrosion-resistant joints for components subjected to mechanical stress, such as those found in high-speed rails and motor control units.
• Biomedical and Antimicrobial Applications: Combining the potent antimicrobial properties of both silver and copper, these alloy nanoparticles exhibit a synergistic effect against a broad spectrum of bacteria, fungi, and viruses. They are incorporated into medical device coatings, wound dressings, and hospital surfaces to prevent biofilm formation. The alloy's controlled ion release mechanism often provides a more sustained antimicrobial effect than individual silver nanoparticles.
• Catalysis and Chemical Processing: The high surface-area-to-volume ratio of Ag-Cu alloy nanopowders makes them highly efficient catalysts for various industrial chemical reactions. They are particularly effective in oxidation processes and the electrochemical reduction of carbon dioxide (CO2). The synergistic interaction between Ag and Cu atoms on the nanoparticle surface allows for better selectivity and lower activation energy in complex catalytic cycles.
• Surface Coatings and Infrastructure: In the construction and textile industries, Ag-Cu nanoparticles are integrated into paints, polymers, and protective coatings to impart long-lasting antibacterial and anti-corrosive properties. These coatings are essential for maintaining hygiene in public transportation and high-traffic architectural environments, where they protect surfaces from degradation caused by environmental factors and microbial growth.

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