Copper Conductive Paste for Printed Circuits, Curing Temperature: 120–150 °C

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Product Overview of Copper Conductive Paste for Printed Circuits, Curing Temperature: 120–150 °C

This copper conductive paste is designed for screen printing conductive patterns on rigid and flexible circuit boards, LED components, and electroluminescent (EL) films. It contains fine copper particles uniformly dispersed in an organic solvent-based medium to support consistent printing and conductive layer formation. Following thermal curing, the paste forms a dense conductive coating with good surface hardness and wear resistance. It is intended for printed electronic applications requiring electrical conductivity, adhesion, and defined circuit patterns.

Technical Properties of Copper Conductive Paste for Printed Circuits, Curing Temperature: 120–150 °C

Applications of Copper Conductive Paste for Printed Circuits, Curing Temperature: 120–150 °C

• RFID Antenna Development: Can be evaluated for screen-printed RFID antenna patterns on compatible substrates.
• Rigid Printed Circuits: Used to screen print conductive tracks and patterns on compatible rigid circuit substrates.
• Flexible Printed Circuits: Applied to compatible flexible circuit substrates to form conductive paths for flexible electronic assemblies.
• LED Components and Circuits: Used to produce printed conductive patterns and electrical interconnections in LED-related applications.
• Electroluminescent Films: Used for printed conductive features in EL film assemblies, with substrate compatibility and circuit requirements verified before production.