Solderable Silver Paste, Sintering Temperature: ~850 °C, Solid Content: 75±5 wt%

25 grams: 230 €                         
100 grams: 670 € 
500 grams: 2280 € 
1000 grams: 3940 € 

Contact us for tailored quotes on larger quantities & experience exceptional solutions from our experts.

Solderable Silver Paste

Sintering Temperature: ~850 °C, Solid Content: 75±5 wt%

Solderable silver paste is an eco-friendly electrode material specially developed for high voltage capacitor applications. After sintering, it forms a dense and smooth silver layer that ensures high conductivity, strong mechanical strength, and reliable connections. It delivers superior solderability and adhesion in both manual and reflow soldering processes. Its lead- and cadmium-free formulation enables safe production. With proper stirring, controlled drying, and binder burnout steps, followed by sintering at 850±50℃, optimum results are achieved. The product is an ideal solution for capacitor manufacturing that requires long-term performance and high efficiency. The paste is compatible with 300–500 mesh stainless steel screen printing and can be processed using either tunnel or muffle furnaces. It is an ideal solution for capacitor manufacturing that requires long-term performance, high efficiency, and process flexibility.

Technical Properties

Applications

• Ceramic Capacitor Manufacturing: Solderable Silver Paste forms dense and conductive external electrodes on ceramic capacitors, especially high-voltage types, ensuring reliable electrical contact and long-term performance after sintering at elevated temperatures.
• Printed Circuit Boards (PCBs): The paste enables low-resistance interconnections and repair of damaged traces in PCBs, offering excellent adhesion and solderability for both manual and automated soldering processes.
• Flexible Electronics and Hybrid Circuits: With compatibility for screen printing on flexible substrates, the paste supports conductive layer formation in hybrid circuits and flexible electronic modules used in compact devices.
• Solar Cell Metallization: Solderable silver paste is used to print front-side conductive fingers and busbars on solar cells, facilitating efficient current collection and transfer with minimal resistive losses.
• Sensor and Transducer Technologies: The paste serves as a stable electrode material in piezoelectric and pressure sensors, providing consistent conductivity and mechanical bonding to ceramic substrates.
• Automotive Electronics: In automotive control modules and sensor assemblies, the paste ensures durable electrical connections under thermal cycling and vibration, supporting long-term reliability in harsh environments.
• LED and Lighting Components: Silver paste is applied to ceramic-based LED packages to form solderable contacts that maintain high reflectivity and thermal stability during reflow soldering.
• Consumer Electronics Assembly: Used in bonding and interconnects for small-scale devices, the paste supports compact layouts and high-density packaging with excellent printability and curing behavior.

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