Silver Conductive Adhesive Paste

Silver Conductive Adhesive Paste (NG10SM0106) is a high-performance engineering adhesive specifically formulated to provide superior electrical signal integrity and robust mechanical bonding in advanced microelectronics and display technologies. By integrating a high-purity silver-filled matrix, this paste facilitates exceptional electron transport while simultaneously acting as an efficient thermal interface to enhance heat dissipation in high-density hardware. Its advanced curing kinetics are engineered for versatility, allowing for stable performance on heat-sensitive substrates through moderate temperature or room-condition processing without compromising substrate integrity. Once cured, the paste exhibits a high-hardness, "no-shedding" adhesion profile that ensures long-term operational reliability and resistance to damp-heat environments, making it an ideal solution for durable interconnections in both rigid and flexible electronic architectures.

Technical Properties

SEM Image

Applications

• Photovoltaic (PV) Industry: Extensively used for the fabrication of backside and inner electrodes in solar cells, providing reliable charge collection and exceptional stability in damp-heat environments.
• Flexible Electronics: Integrated into the manufacturing of PET or Polyimide-based circuits, where its ability to cure at room temperature or low temperatures prevents thermal damage to sensitive substrates.
• Display Technology: Utilized in the assembly of smartphone and tablet display modules to create durable conductive bonds that withstand significant mechanical stress and physical impact.
• LED and Semiconductor Packaging: Serves as a high-performance alternative to traditional soldering for LED module integration, leveraging its thermal conductivity to manage heat in compact architectures.
• Industrial and Consumer Electronics: Acts as a primary conductive interconnect for various home supplies and electronic hardware, ensuring performance stability across a wide temperature range from -50°C to +150°C.
• EMI/RFI Shielding: Applied in bonding conductive components or enclosures to effectively reduce electromagnetic interference in sensitive high-frequency circuitry.
• Sensor Fabrication: Ideal for attaching electrodes in precision devices where high shear strength and specific volume resistance are required for accurate signal transmission.

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