Silver Conductive Adhesive Paste

Surface Curing: 60℃~100℃ (20-40 min); Room Temperature (2~5 Hours) 

Silver conductive adhesive is an engineered solution designed for advanced electronic packaging and interconnect technologies where high thermal reliability and superior electrical signal integrity are paramount. Formulated with a high-density silver filler matrix, the paste exhibits an optimized rheological profile suitable for high-precision dispensing, ensuring uniform bond lines and void-free interfaces. Its hallmark feature is the mild-temperature curing kinetics, which allows for robust cross-linking without compromising the structural integrity of heat-sensitive substrates or delicate semiconductor components. By balancing high mechanical shear strength with low volume resistivity, this conductive adhesive provides a reliable, long-term solution for demanding microelectronic environments subject to thermal cycling and mechanical stress.

Technical Properties

Applications

• Electronics Manufacturing Sector: In the electronics manufacturing sector, it serves as a high-performance alternative to traditional soldering, especially for interconnecting heat-sensitive components where high-temperature processing is impractical.
• Flexible Electronics Industry: In the flexible electronics industry, it is utilized for bonding conductive traces on flexible substrates such as PET or polyimide films, maintaining electrical integrity without damaging the polymer base.
• Telecommunications and Aerospace: In the telecommunications and aerospace sectors, it is employed for EMI/RFI shielding by bonding conductive components or enclosures to effectively reduce electromagnetic interference in sensitive circuitry.
• Optoelectronics and LED Assembly: In the optoelectronics sector, it provides critical conductive and adhesive functions in LED module integration, ensuring stable electrical paths and efficient thermal management.
• Sensor and Instrumentation Development: In the sensor fabrication sector, it is ideal for attaching and connecting electrodes or sensor elements in precision devices that require fine electrical conductivity and mechanical stability.
• PCB Repair and Maintenance: In the electronics repair sector, it enables fast and reliable electrical interconnections for printed circuit board (PCB) traces without the need for high-temperature thermal stress.

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