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Ruthenium nanoparticles/nanopowder are easily reducible plate-like fine metallic particles that crystallize into a hexagonal compact structure. The anisotropic growth of ruthenium nanoparticles is possible in homogenous solutions due to the hexagonal structure that they adopt. Nevertheless, the majority of transition metals have a cubic crystalline structure and lack the anisotropic growth. Elemental ruthenium a rare silvery hard metal placed among the transition metals of platinum group. …

The high capacities in the field of lamination and metallization have in recent years allowed the development of a new type of protective film. We are talking about the latest generation of solar films, Sputtered series films, the result of research and experimentation in the aerospace sector that are produced using the process called "sputtering". It is a technological process based on ionic pulverization able to overcome the problem of the low energy of the atom. The disintegration of m …

Silicon with the chemical symbol of Si and the atomic number 14 is a metalloid with the melting and boiling point of 1414˚C and 3265˚C, respectively. It comes from the group IV of the periodic table where Carbon comes first on the top of the group and the eighth most occurring element in the universe and the second most abundant element in the Earth’s crust (nearly 28%). Silicon has also been detected in the Sun and other stars. There is evidence of silicon in meteorites called aerolites …

Nanoparticles of platinum have an important role in various fields. The most important of them being the energy and medicine industries. Readily exploited properties of platinum are enhanced through nanotechnology to increase the efficiency of its applications. Fuel cells, biosensors, and medical treatments have been greatly affected by the development of Pt-based nanoparticles. What is Platinum? Platinum was discovered in South America before Columbus and its name is derived from the Spanish wo …

Silver conductive adhesive paste is an electrically conductive adhesive (ECA) made of silver particles dispersed in a resin binder, typically epoxy, polymer, or glass-based. Once cured, it forms a mechanically strong bond that also carries electrical current, making it a widely used alternative to soldering wherever heat-sensitive components, flexible substrates, or fine-pitch assembly are involved. Its growing role in flexible and printed electronics has made it one of the fastest-moving segmen …