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Highly Conductive Expanded Graphite Micron Powder, Purity: ≥ 96%, Size: 70 µm

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NG04EO0723
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25 grams/29 € 
100 grams/119 €   
500 grams/221 €  
1 kg/332 €   

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Highly Conductive Expanded Graphite Micron Powder

Purity: ≥ 96%, Size: 70 µm

Highly Conductive Expanded Graphite Micron Powder is a micronized conductive filler produced from natural flake graphite through controlled chemical or electrochemical expansion followed by precision milling, resulting in a porous, high–surface-area, worm-like layered structure that enables the formation of conductive networks within polymeric and inorganic matrices. With a carbon content of ≥96% and a median particle size of 70 µm, the product provides effective electrical and thermal conductivity while also contributing chemical resistance, thermal stability, and intrinsic lubricity to formulated systems. Supplied as a free-flowing dry powder, it is suitable for solid-state processing routes such as dry blending, melt compounding, and powder coating formulations, where it functions as an antistatic and conductive additive while maintaining stability under elevated temperature and chemically aggressive conditions.

Technical Properties

Average Particle Size

70 µm

Density 120 g/l
Carbon Content (%) (at 800 °C; 20 h) ≥96
Moisture Content (%) (at 110 °C; 8 h) ≤5 
CAS No 7782-42-5

Applications

  • Powder Coatings & Industrial Coatings: Provides antistatic behavior and controlled electrical conductivity, enabling electrostatic charge dissipation on coated metal and composite parts, supporting heat dissipation, and contributing to EMI/RFI shielding performance in protective and functional coating systems.
  • Plastics, Rubber & Composite Materials: Enhances thermal and electrical conductivity, reduces electrostatic charge accumulation, and improves dimensional stability under thermal load; supports multifunctional composite performance by combining conductivity with chemical resistance.
  • Adhesives & Sealants: Acts as a conductive filler to enable static dissipation and thermal transfer across bonded interfaces, improving reliability in electronic housings and mechanically stressed assemblies.
  • Fire Protection & Insulation Materials: Contributes to fire resistance in intumescent coatings, fire-retardant foams, and insulation boards through thermal stability and barrier-forming (char-promoting) characteristics during high-temperature exposure.
  • Foundry, Sealing & Mechanical Applications: Used in molding compounds, graphite foils, braided packings, gaskets, and self-lubricating components where high temperature resistance, chemical durability, wear reduction, and long-term sealing performance are required. 

 

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