25 grams/ 13 €                         
100 grams/ 46 €   
500 grams/ 190 €   
1000 grams/ 324 €    

Aluminum Nitride (AlN) Micron Powder

Purity: 99.5%, Size: 1-10 µm

Aluminum Nitride (AlN) Micron Powder is a high-purity technical ceramic material characterized by its exceptional combination of high thermal conductivity and superior electrical insulation. With a precisely controlled particle size distribution of 1-10 µm, this powder serves as an ideal filler and structural component for advanced thermal management systems. Unlike most ceramic materials, AlN possesses a thermal expansion coefficient that closely matches that of silicon, making it indispensable for semiconductor applications. This micron-sized powder is engineered for excellent dispersibility in polymer and ceramic matrices, ensuring uniform performance in demanding environments. Its chemical stability and resistance to molten metals further enhance its utility in high-temperature industrial processes.

 Technical Properties

Applications

• Thermal Management in Electronics: Extensively used as a filler in thermal interface materials (TIMs), such as thermal greases, adhesives, and gap fillers. It helps dissipate heat from high-power CPUs and GPUs while maintaining electrical isolation.
• Semiconductor Substrates: Due to its silicon-matching thermal expansion, it is used to manufacture AlN substrates and heat sinks for IC packaging, power modules, and laser diodes.
• Optoelectronics: Used in the production of LED heat sinks and substrates where high power density requires rapid heat removal to maintain light efficiency and device longevity.
• Ceramic Manufacturing: Acts as a primary raw material for high-performance AlN ceramic parts produced via sintering or hot-pressing, used in crucible manufacturing and semiconductor processing equipment.
• Molten Metal Handling: Employed in the fabrication of crucibles and protective tubes for melting aluminum and other non-ferrous metals, thanks to its excellent resistance to chemical corrosion and wetting.
• Aerospace and Defense: Integrated into high-temperature structural components and radomes where both mechanical strength and thermal stability are required under extreme conditions.
• Polymer Composites: Added to epoxy and silicone resins to create thermally conductive but electrically insulating encapsulation materials for automotive and industrial power electronics.