Description
Silver Conductive Paste
Curing Temperature: ~80℃
Silver conductive paste is a single-component, room-temperature curable conductive adhesive designed for versatile electronic applications. With medium viscosity and bonding strength, it provides excellent electrical conductivity, high thermal resistance, and stable performance across a wide operating temperature range. The formulation is easy to process and can be stored at room temperature, making it suitable for both flexible and rigid circuit designs.
Technical Properties
| Solid Content | 70 wt% |
| Viscosity | 6000-9000 CP (25℃/10 rpm) |
| Decomposition Temperature | 200℃ |
| Glass Transition Temperature | 55℃ |
| Surface Curing Conditions | 60℃-100℃ (20-40 min), Room Temperature(2-5 Hours) |
| Operating Temperature | –50 °C to 150 °C |
| Thermal Conductivity | 2.5 W/m.℃ |
| Shear Strength | > 3 MPa |
| Impact Strength | > 6 kg/5000 Pa |
| Volume Resistivity | 0.002 Ω.cm |
| CAS No | 7440-22-4 |
Applications
- Flexible and Rigid Printed Circuits: Printing conductive electrodes on PET, PE, and rigid substrates.
- Electroluminescent (EL) Panels: Used for electrode formation in EL lighting and display panels.
- Touch Screens and Circuit Keyboards: Provides reliable conductive paths for input devices.
- EMI Shielding and Antenna Repair: Effective for restoring conductivity and reducing interference in sensitive circuits.
- Mobile Phone and Communication Equipment Repair: Suitable for repairing conductive tracks and interconnects.
- General Electronics Fabrication: Applicable in prototyping and small-scale production requiring low-temperature curing and stable conductivity.